# US 2014/0190273 A1 · Flow Sensor and Manufacturing Method of the Same and Flow Sensor Module and Manufacturing Method of the Same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190273 A1 - Document ID: US20140190273A1 - Status: Published application - Kind: A1 - Application number: 14/210,787 - Filed: 2014-03-14 - Published: 2014-07-10 - Earliest claimed: 2010-10-13 - Assignees: Hitachi Automotive Systems, Ltd. - Applicants: Hitachi Automotive Systems, Ltd. - Inventors: Tsutomu KONO; Keiji HANZAWA; Takeshi MORINO; Yuki OKAMOTO; Noboru TOKUYASU; Shinobu TASHIRO - Web page: https://patentgrep.com/patent/US20140190273A1 ## CPC - G01F 1/383: {with electrical or electro-mechanical indication} - G01F 1/34: by measuring pressure or differential pressure - G01F 1/6845: {Micromachined devices} - G01F 1/692: Thin-film arrangements - G01F 1/698: Feedback or rebalancing circuits, e.g. self heated constant temperature flowmeters - G01F 5/00: Measuring a proportion of the volume flow - H10W 70/681: {comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage} - H10W 70/682: {comprising holes having chips therein} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - G01F: MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, apart of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR). ## Claims ### Claim 1 A flow sensor module comprising: a flow sensor in which a semiconductor chip is sealed with a first resin, the semiconductor chip including a flow sensing unit formed on a main surface of a semiconductor substrate and a diaphragm formed in a region facing the flow sensing unit of a rear surface opposite to the main surface of the semiconductor substrate, while having the flow sensing unit exposed; a flow path unit for guiding a gas to the flow sensing unit of the flow sensor; and a second resin formed so as to cover a further outer side of the first resin sealing the flow sensor and further so as to expose the flow sensing unit, wherein the flow path unit includes a groove formed to a surface of the second resin, and a cover disposed in a region that faces the groove. ### Claim 2 A flow sensor module comprising: a flow sensor in which a semiconductor chip is sealed with a first resin, the semiconductor chip including a flow sensing unit formed on a main surface of a semiconductor substrate and a diaphragm formed in a region facing the flow sensing unit of a rear surface opposite to the main surface of the semiconductor substrate, while having the flow sensing unit exposed; a flow path unit for guiding a gas to the flow sensing unit of the flow sensor; and a second resin formed so as to cover a further outer side of the first resin sealing the flow sensor and further so as to expose the flow sensing unit, wherein the flow path unit includes the second resin and a cover having a region in which a groove is formed, the region facing the second resin. ### Claim 3 (depends on 1) The flow sensor module according to claim 1, wherein the semiconductor chip configuring the flow sensor is mounted on a chip mounting unit, wherein the chip mounting unit has a first opening formed therein in a region that overlaps with the diaphragm formed on the semiconductor chip when viewed in plan view, wherein a rear surface of the chip mounting unit is further covered with the first resin having a second opening formed therein being communicated with the first opening, and wherein a cross-sectional area of the first opening formed in the chip mounting unit is smaller than a cross-sectional area of the second opening formed in the first resin. ### Claim 4 (depends on 2) The flow sensor module according to claim 2, wherein the semiconductor chip configuring the flow sensor is mounted on a chip mounting unit, wherein the chip mounting unit has a first opening formed therein in a region that overlaps with the diaphragm formed on the semiconductor chip when viewed in plan view, wherein a rear surface of the chip mounting unit is further covered with the first resin having a second opening formed therein being communicated with the first opening, and wherein a cross-sectional area of the first opening formed in the chip mounting unit is smaller than a cross-sectional area of the second opening formed in the first resin. ### Claim 5 (depends on 3) The flow sensor module according to claim 3, wherein a rear surface of the first resin having the second opening formed therein is further covered with the second resin having a third opening formed therein being communicated with the second opening, and wherein a cross-sectional area of the second opening formed in the first resin is smaller than a cross-sectional area of the third opening formed in the second resin. ### Claim 6 (depends on 4) The flow sensor module according to claim 4, wherein a rear surface of the first resin having the second opening formed therein is further covered with the second resin having a third opening formed therein being communicated with the second opening, and wherein a cross-sectional area of the second opening formed in the first resin is smaller than a cross-sectional area of the third opening formed in the second resin. ### Claim 7 (depends on 1) The flow sensor module according to claim 1, wherein the semiconductor chip configuring the flow sensor is mounted on a substrate, and the substrate has an opening formed therein in a region that overlaps with the diaphragm formed on the semiconductor chip when viewed in plan view. ### Claim 8 (depends on 2) The flow sensor module according to claim 2, wherein the semiconductor chip configuring the flow sensor is mounted on a substrate, and the substrate has an opening formed therein in a region that overlaps with the diaphragm formed on the semiconductor chip when viewed in plan view. ### Claim 9 (depends on 7) The flow sensor module according to claim 7, wherein a rear surface of the substrate is further covered with the second resin having a third opening formed therein being communicated with the opening, and wherein a cross-sectional area of the opening formed in the substrate is smaller than a cross-sectional area of the third opening formed in the second resin. ### Claim 10 (depends on 8) The flow sensor module according to claim 8, wherein a rear surface of the substrate is further covered with the second resin having a third opening formed therein being communicated with the opening, and wherein a cross-sectional area of the opening formed in the substrate is smaller than a cross-sectional area of the third opening formed in the second resin. ### Claim 11 (depends on 1) The flow sensor according to claim 1, wherein, in an optional cross-section parallel to a traveling direction of the gas that flows above the exposed flow sensing unit, the first resin partially covers an upper part of the semiconductor chip. ### Claim 12 (depends on 2) The flow sensor according to claim 2, wherein, in an optional cross-section parallel to a traveling direction of the gas that flows above the exposed flow sensing unit, the first resin partially covers an upper part of the semiconductor chip. ### Claim 13 (depends on 1) The flow sensor according to claim 1, wherein, in an optional cross-section parallel to a traveling direction of the gas that flows above the exposed flow sensing unit, an upper surface of the first resin is lower than an upper surface of the semiconductor chip in a first region in which the first resin contacts the semiconductor chip, and a height of the upper surface of the first resin is higher than a height of the upper surface of the semiconductor chip in at least a part of a second region more apart from the semiconductor chip than the first region. ### Claim 14 (depends on 2) The flow sensor according to claim 2, wherein, in an optional cross-section parallel to a traveling direction of the gas that flows above the exposed flow sensing unit, an upper surface of the first resin is lower than an upper surface of the semiconductor chip in a first region in which the first resin contacts the semiconductor chip, and a height of the upper surface of the first resin is higher than a height of the upper surface of the semiconductor chip in at least a part of a second region more apart from the semiconductor chip than the first region.