# US 2014/0190260 A1 · Mems apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190260 A1 - Document ID: US20140190260A1 - Status: Published application - Kind: A1 - Application number: 14/151,622 - Filed: 2014-01-09 - Published: 2014-07-10 - Earliest claimed: 2013-01-09 - Assignees: Kuan-Wen CHEN - Inventors: Mao-Chen LIU; Wen-Chieh CHOU; Po-Wei LU; Shu-Yi WENG; Chun-Chieh WANG - Web page: https://patentgrep.com/patent/US20140190260A1 ## CPC - G01P 15/0802: {Details} - B81B 3/0072: {For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers} - G01P 15/125: by capacitive pick-up - B81B 2201/0235: Accelerometers - G01P: MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT (measuring or recording blood flow A61B5/02, A61B8/06; monitoring speed or deceleration of electrically-propelled vehicles B60L3/00; vehicle lighting systems adapted to indicate speed B60Q1/54; determining position or course in navigation, measuring ground distance in geodesy or surveying G01C; combined measuring devices for measuring two or more variables of movement G01C23/00; measuring velocity of sound G01H; measuring velocity of light G01J7/00; measuring direction or velocity of solid objects by reception or emission of radiowaves or other waves and based on propagation effects, e.g. Doppler effect, propagation time, direction of propagation, G01S; measuring speed of nuclear radiation G01T; measuring acceleration of gravity G01V; {measuring or recording the speed of trains B61L23/00; speed indicators incorporated in motor vehicles B60K35/00; measuring frequency or phase G01R; traffic control G08G}) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract Disclosed herein is a MEMS apparatus comprising a substrate with an etched area, a proof mass disposed at the center of the etched area, and beams supporting the proof mass. The beams are disposed between peripheries of the substrate and the proof mass. The substrate comprises first and second electrodes that are parallel to an axis and extend respectively from opposite regions on the substrate. The proof mass comprises third and fourth electrodes that are parallel to the axis and extend respectively from opposite edges of the proof mass. The first and third electrodes are opposite to and interlaid with each other. The second and fourth electrodes are opposite to and interlaid with each other. With the proof mass constructed as an oxide layer optionally enclosing a connecting layer or as a silicon substrate optionally with a covering layer, the MEMS apparatus is not susceptible to the variation of temperature. ## Claims ### Claim 1 A MEMS (microelectromechanical systems) apparatus comprising: a substrate comprising first electrodes, second electrodes, a first region, a second region, and an etched area, the etched area located at the center of the substrate, the first region and the second region opposite each other, the first electrodes equidistantly located in the first region, the second electrodes equidistantly located in the second region; a proof mass disposed at the center of the substrate and comprising third electrodes, fourth electrodes, a first edge, and a second edge, the first edge and the second edge opposite each other, the third electrodes equidistantly located on the first edge, the fourth electrodes equidistantly located on the second edge; and beams respectively disposed between a periphery of the substrate and a periphery of the proof mass and configured to support the proof mass so that the proof mass and the substrate are a first distance apart; wherein each of the first electrodes, parallel to an axis, extends along the axis towards the first edge from the first region by a second distance, and each of the third electrodes, parallel to the axis, extends along the axis towards the first region from the first edge by a third distance, the first electrodes and the third electrodes opposite to and interlaid with each other, the second distance and the third distance greater than half of but no greater than the first distance; wherein each of the second electrodes, parallel to the axis, extends along the axis towards the second edge from the second region by the second distance, and each of the fourth electrodes, parallel to the axis, extends along the axis towards the second region from the second edge by the third distance, the second electrodes and the fourth electrodes opposite to and interlaid with each other. ### Claim 2 (depends on 1) The MEMS apparatus of claim 1, wherein the substrate is made of silicon. ### Claim 3 (depends on 1) The MEMS apparatus of claim 1, wherein the proof mass is made of silicon dioxide. ### Claim 4 (depends on 3) The MEMS apparatus of claim 3, wherein the coefficient of thermal expansion of the proof mass is 0.5 ppm/° C. ### Claim 5 (depends on 4) The MEMS apparatus of claim 4, wherein the proof mass further comprises a connecting layer made of tungsten. ### Claim 6 (depends on 5) The MEMS apparatus of claim 5, wherein the coefficient of thermal expansion of the connecting layer is 4 ppm/° C. ### Claim 7 (depends on 1) The MEMS apparatus of claim 1, wherein the coefficient of thermal expansion of the proof mass is 3 ppm/° C. ### Claim 8 (depends on 7) The MEMS apparatus of claim 7, wherein the proof mass further comprises a covering layer made of metal or oxide. ### Claim 9 (depends on 8) The MEMS apparatus of claim 8, wherein the coefficient of thermal expansion of the covering layer is 0.5 ppm/° C. ### Claim 10 (depends on 1) The MEMS apparatus of claim 1, wherein the beams are made of metal.