# US 2014/0190210 A1 · Method for Bonding Substrates > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190210 A1 - Document ID: US20140190210A1 - Status: Published application - Kind: A1 - Application number: 13/734,884 - Filed: 2013-01-04 - Published: 2014-07-10 - Earliest claimed: 2013-01-04 - Assignees: Lilliputian Systems, Inc. - Applicants: Lilliputian Systems, Inc. - Inventors: Mohammad Masyood Akhtar; Zachary Byars; Samuel B. Schaevitz - Web page: https://patentgrep.com/patent/US20140190210A1 ## CPC - C03C 8/24: Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders - C09J 5/06: involving heating of the applied adhesive - F16B 11/006: {by gluing (gluing of plastics material B29C65/48)} - H01M 8/0282: Inorganic material - H01M 8/0286: Processes for forming seals - H01M 2008/1293: {Fuel cells with solid oxide electrolytes} - Y02E 60/50: Fuel cells - C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - F16B: DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING (couplings for transmitting rotation F16D) - H01M: PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION ## Abstract The method for bonding a first substrate to a second substrate includes dispensing a paste directly onto a first substrate, the paste including a glass powder, a thermoplastic, and a first solvent, evaporating the first solvent to form a thickened paste, placing a second substrate on the thickened paste to form a stack, applying to the stack a force sufficient to cause deformation of the thickened paste, and heating the stack to a bonding temperature above a glass transition temperature of the glass powder so as to cause removal of the thermoplastic from the thickened paste and to form a glass joint between the first and second substrates. ## Claims ### Claim 1 A method for bonding a first substrate to a second substrate, the method comprising: dispensing a paste directly onto the first substrate, the paste including a glass powder, a thermoplastic, and a first solvent; evaporating the first solvent to form a thickened paste; placing the second substrate on the thickened paste to form a stack; applying to the stack a force sufficient to cause deformation of the thickened paste; and heating the stack to a bonding temperature above a glass transition temperature of the glass powder so as to cause removal of the thermoplastic from the thickened paste and to form a glass joint between the first and second substrates. ### Claim 2 (depends on 1) A method according to claim 1, wherein the applying and heating processes are performed simultaneously. ### Claim 3 (depends on 1) A method according to claim 1, wherein the applying and heating processes are performed sequentially. ### Claim 4 (depends on 3) A method according to claim 3, wherein the applying process is performed before the heating process. ### Claim 5 (depends on 3) A method according to claim 3, wherein the applying process is performed after the heating process has begun and before the removal of the thermoplastic has completed. ### Claim 6 (depends on 1) A method according to claim 1, wherein the paste further includes a second solvent that evaporates more slowly than the first solvent during the evaporating process, and evaporating the first solvent includes evaporating substantially all of the first solvent while retaining a substantial portion of the second solvent in the thickened paste. ### Claim 7 (depends on 1) A method according to claim 1, for bonding more than two substrates together, further comprising: dispensing the paste directly onto a plurality of substrates; and placing all of the substrates into the stack. ### Claim 8 (depends on 1) A method according to claim 1, wherein evaporating the first solvent comprises heating the first substrate to a temperature between about 40 and about 200 degrees Celsius. ### Claim 9 (depends on 1) A method according to claim 1, further comprising: before applying the force, heating the stack above a glass transition temperature of the thermoplastic. ### Claim 10 (depends on 1) A method according to claim 1, wherein applying the force includes maintaining the force on the stack during the process of heating the stack above the glass transition temperature of the thermoplastic. ### Claim 11 (depends on 1) A method according to claim 1, wherein heating the stack includes first heating the stack to a burnout temperature to cause removal of the thermoplastic and then heating the stack to the bonding temperature. ### Claim 12 (depends on 1) A method according to claim 1, wherein dispensing the paste includes forming the paste into a shape on the first substrate, the shape comprising a strip having a longitudinal axis along a surface of the first substrate, a thickness in a direction normal to the surface, and a width along the surface and normal to the longitudinal axis, wherein the ratio of the width to the thickness is less than about 40. ### Claim 13 (depends on 12) A method according to claim 12, wherein applying the force includes applying sufficient force that the maximum thickness of the shape is reduced by at least 10% after the force has been applied to the stack. ### Claim 14 (depends on 1) A method according to claim 1, wherein dispensing the paste includes forming the paste into a shape on the first substrate, the shape covering an area on a surface of the first substrate, and wherein the force in Newtons per unit of the area in square millimeters is greater than 0.1 Newtons per square millimeter. ### Claim 15 (depends on 1) A method according to claim 1, wherein dispensing includes applying the paste by screen-printing. ### Claim 16 (depends on 1) A method according to claim 1, wherein dispensing includes applying the paste via a nozzle.