# US 2014/0190000 A1 · Systems and methods for providing refurbished or remanufactured electronic devices with moisture-resistant coatings > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190000 A1 - Document ID: US20140190000A1 - Status: Published application - Kind: A1 - Application number: 14/157,780 - Filed: 2014-01-17 - Published: 2014-07-10 - Earliest claimed: 2013-01-08 - Assignees: HZO, Inc. - Applicants: HzO, Inc. - Inventors: Blake Stevens; Max Sorenson; Scott B. Gordon - Web page: https://patentgrep.com/patent/US20140190000A1 ## CPC - H05K 3/30: Assembling printed circuits with electric components, e.g. with resistors - H05K 3/225: {Correcting or repairing of printed circuits (H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence)} - H05K 13/0486: {Replacement and removal of components} - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 3/285: {Permanent coating compositions} - H05K 3/288: {Removal of non-metallic coatings, e.g. for repairing} - H05K 2203/1338: Chemical vapour deposition - H05K 2203/176: Removing, replacing or disconnecting component; Easily removable component - Y10T 29/49002: Electrical device making - Y10T 29/49004: including measuring or testing of device or component part - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - Y10T 29/53174: Means to fasten electrical component to wiring board, base, or substrate - Y10T 29/53274: Means to disassemble electrical device - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An approach to refurbishing or remanufacturing an electronic device may involve exposing electrical components that are situated within an interior of the electronic device. The approach may also involve replacing one or more defective electronic components of the electronic device with one or more replacement components and applying a protective coating to at least a portion of the interior of the electronic device. The protective coating may cover the circuit board and the electronic components it carries. The protective coating may also cover at least some of the electrical connections of the electronic device. The protective coating may also be applied to the replacement component prior to reassembly. The resulting refurbished or remanufactured electronic device may thus be provided with moisture resistance to help protect the electronic device from damage caused by exposure to moisture. ## Claims ### Claim 1 A method for refurbishing or remanufacturing an electronic device comprising: exposing one or more components within an interior of an electronic device; replacing one or more defective components of the electronic device with one or more replacement electronic components; applying a protective coating to: at least a portion of the interior of the electronic device; or one or more of the replacement electronic components. ### Claim 2 (depends on 1) The method of claim 1, comprising applying the protective coating to at least one replacement component of the one or more replacement electronic components after replacing one or more defective components. ### Claim 3 (depends on 1) The method of claim 1, comprising applying the protective coating to at least one replacement component of the one or more replacement electronic components before replacing one or more defective components. ### Claim 4 (depends on 3) The method of claim 3, wherein applying the protective coating comprises applying the protective coating to at least an intermediate conductive element electrically coupling a conductive element of a circuit board of the electronic device and a conductive element of the at least one replacement component. ### Claim 5 (depends on 1) The method of claim 1, further comprising: removing at least a portion of one or more existing protective coatings from the one or more components of the electronic device. ### Claim 6 (depends on 5) The method of claim 5, wherein removing at least a portion of the one or more existing protective coatings comprises removing the existing protective coatings from one or more conductive elements of a circuit board. ### Claim 7 (depends on 6) The method of claim 6, wherein removing at least a portion of the one or more existing protective coatings comprises removing the existing protective coatings from one or more conductive elements of the circuit board connected to the defective electronic components. ### Claim 8 A method for refurbishing or remanufacturing an electronic device comprising: exposing one or more electronic components within an interior of an electronic device; replacing one or more defective electronic components of the electronic device with one or more replacement electronic components; and applying a protective coating to at least a portion of the interior of the electronic device, at least a portion of at least one surface within the interior of the electronic device being exposed through or laterally beyond the protective coating. ### Claim 9 (depends on 8) The method of claim 8, further comprising: applying a second protective coating to at least a portion of the interior of the electronic device. ### Claim 10 (depends on 9) The method of claim 9, wherein the second protective coating is the same material as the first protective coating. ### Claim 11 (depends on 9) The method of claim 9, wherein the second protective coating is a different material than the first protective coating. ### Claim 12 (depends on 9) The method of claim 9, wherein applying the second protective coating comprises applying the second protective coating to at least a portion of the interior of the electronic device over one or more replacement electronic components. ### Claim 13 A system for refurbishing or remanufacturing an electronic device, the system comprising: a diagnosis element for identifying one or more defective components within an electronic device; a receiving element for receiving a subassembly of the electronic device, the subassembly comprising a plurality of components; and a coating element in which a protective coating is applied to at least a portion of the subassembly, including over electrical connections of the subassembly. ### Claim 14 (depends on 13) The system of claim 13, further comprising: a removal element for removing the one or more defective components from the subassembly. ### Claim 15 (depends on 14) The system of claim 14, further comprising: a replacement element for replacing the one or more defective components with one or more replacement components. ### Claim 16 (depends on 13) The system of claim 13, further comprising: a masking element for masking areas of the subassembly where the protective coating is not desired. ### Claim 17 (depends on 13) The system of claim 13, wherein the coating element comprises an apparatus for depositing a polymer onto at least a portion of the subassembly. ### Claim 18 (depends on 17) The system of claim 17, wherein the coating element comprises a molecular diffusion apparatus. ### Claim 19 (depends on 17) The system of claim 17, wherein the coating element comprises a deposition apparatus for forming reactive species that polymerize on the subassembly. ### Claim 20 (depends on 19) The system of claim 19, wherein the deposition apparatus is configured to vaporize at least one type of [2,2] paracyclophane, to pyrolyze the [2,2] paracyclophane to form p-xylylene intermediates and to enable the p-xylylene intermediates to polymerize on the subassembly to form a poly(p-xylylene) polymer on the subassembly. ### Claim 21 (depends on 13) The system of claim 13, further comprising: a surface treatment element located upstream from the coating element. ### Claim 22 (depends on 21) The system of claim 21, wherein the surface treatment element is configured to enhance adhesion of the protective coating to at least a portion of the subassembly. ### Claim 23 (depends on 13) The system of claim 13, further comprising: a material removal element configured to remove at least a portion of an existing protective coating from the subassembly. ### Claim 24 (depends on 23) The system of claim 23, wherein the material removal element is configured to remove at least a portion of the existing protective coating from the subassembly at the location of at least one defective component. ### Claim 25 A method for refurbishing or remanufacturing an electronic device comprising: obtaining an electronic device that has been completely assembled; opening the electronic device; and applying a protective coating to portions of components or features of the electronic device after opening the electronic device. ### Claim 26 (depends on 25) The method of claim 25, further comprising: diagnosing a defect in the electronic device; and removing at least one defective component from the defective device. ### Claim 27 (depends on 26) The method of claim 26, further comprising: selectively removing or separating at least a portion of a protective coating surrounding the at least one defective component before removing the at least one defective component to enable removal of the at least one defective component without damaging remaining portions of the protective coating. ### Claim 28 (depends on 27) The method of claim 27, further comprising: replacing the at least one defective component with a replacement component before applying the protective coating. ### Claim 29 (depends on 26) The method of claim 26, further comprising: replacing the at least one defective component. ### Claim 30 (depends on 29) The method of claim 29, comprising replacing the at least one defective component before applying the protective coating.