# US 2014/0189998 A1 · Chucking device and chucking method

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- Number: US 2014/0189998 A1
- Document ID: US20140189998A1
- Status: Published application
- Kind: A1
- Application number: 14/148,475
- Filed: 2014-01-06
- Published: 2014-07-10
- Earliest claimed: 2013-01-08
- Assignees: Lasertec Corporation
- Applicants: Lasertec Corporation
- Inventors: Haruhiko KUSUNOSE
- Web page: https://patentgrep.com/patent/US20140189998A1

## CPC

- H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks
- Y10T 29/49998: Work holding
- Y10T 279/11: Vacuum
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Provided are a chucking device having low dusting characteristics and high detergent properties and capable of vacuum-sucking even a substrate having a large warpage, and a chucking method using the same. A chucking device according to an aspect of the present invention vacuum-sucks and holds a wafer. The chucking device includes: a perforated plate having a plurality of through-holes and being mounted with a wafer, the through-holes penetrating through both sides of the perforated plate; a porous plate that supports a surface other than a mounting surface of the perforated plate, on which the wafer is mounted, transmits a vacuum state to the wafer through the plurality of through-holes, and has a pore to limit a flow rate; and a vacuum pump that exhausts an air through the pore of the porous plate.

## Claims

### Claim 1

A chucking device that vacuum-sucks and holds a substrate, the chucking device comprising:
a first plate having a plurality of through-holes and being mounted with a substrate, the plurality of through-holes penetrating through both sides of the first plate;
a member that supports a surface other than a substrate mounting surface of the first plate, transmits a vacuum state to the substrate through the plurality of through-holes, and limits a conductance; and
an exhaust unit that exhausts air through a pore of the member.

### Claim 2 (depends on 1)

The chucking device according to claim 1, wherein the first plate is formed of a dense material.

### Claim 3 (depends on 1)

The chucking device according to claim 1, wherein the member is formed of a porous material.

### Claim 4 (depends on 1)

The chucking device according to claim 1, wherein the member has one of an orifice and a pore to limit a conductance.

### Claim 5 (depends on 1)

The chucking device according to claim 1, further comprising a second plate having a plurality of through-holes and disposed on a side of the member opposite to the first plate,
wherein the exhaust unit vacuum-sucks the substrate through the through-holes of the second plate.

### Claim 6 (depends on 5)

The chucking device according to claim 5, wherein the member is a sheet-like sheet member having a thickness smaller than that of the first and second plates.

### Claim 7 (depends on 6)

The chucking device according to claim 6, wherein the member is a PTFE membrane.

### Claim 8 (depends on 1)

The chucking device according to claim 1, wherein the member is a porous ceramic plate.

### Claim 9 (depends on 1)

A method for chucking a substrate by using a chucking device according to claim 1.