Design system for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates

A semiconductor device manufacturing method;

• comprising
• a numerical value acquiring stage, which acquires the numerical value of at least one calculation parameter,
• a junction estimating stage, which, in the case in which at least two substrates on which a plurality of terminals has been provided are pressed at a prescribed pressure so that the front end faces of the respective mutually corresponding terminals come into contact between the two substrates, estimates whether or not the respective mutually opposing terminals will be respectively joined based on the numerical values of the calculation parameters acquired by the numerical value acquiring stage,
• and a change processing stage which, in the case in which it has been estimated by the junction estimating stage that any of the respective terminals will not be joined, gives a warning or performs processing so as to change the numerical value of at least one of the calculation parameters from among the calculation parameters acquired by the numerical value acquiring stage.

A substrate bonding apparatus;

• comprising
• a first substrate holding part, which holds a first substrate that has a plurality of terminals,
• a second substrate holding part, which holds a second substrate that has a plurality of terminals,
• a numerical value input part, which inputs the numerical value of at least one calculation parameter,
• a calculating part, which calculates the amount of compression of the respective terminals and the amount of bending of the respective substrates when the first substrate and the second substrate are pressed so that the front end faces of the respective terminals of the first substrate come into contact with the front end faces of corresponding terminals among the respective terminals of the second substrate based on the numerical values of the calculation parameters input from the numerical value input part,
• a parameter determining part, which determines a process parameter value so that the total of the compression amount and the bending amount calculated by the calculating part becomes larger than a prescribed value,
• and a pressing part, which presses the first substrate, which is held by the first substrate holding part, and the second substrate, which is held by the second substrate holding part, so that the front end faces of the respective terminals of the first substrate and the front end faces of the respective terminals of the second substrate come into contact based on the process parameter value determined by the parameter determining part.