Computation Memory Operations in a Logic Layer of a Stacked Memory
AssigneeAdvanced Micro Devices, Inc.
InventorsJames M. O'CONNOR, Nuwan S. Jayasena, Gabriel H. Loh, Michael Ignatowski, Michael J. Schulte
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AssigneeAdvanced Micro Devices, Inc.
InventorsJames M. O'CONNOR, Nuwan S. Jayasena, Gabriel H. Loh, Michael Ignatowski, Michael J. Schulte
Estimating the term…
Some die-stacked memories will contain a logic layer in addition to one or more layers of DRAM (or other memory technology). This logic layer may be a discrete logic die or logic on a silicon interposer associated with a stack of memory dies. Additional circuitry/functionality is placed on the logic layer to implement functionality to perform various computation operations. This functionality would be desired where performing the operations locally near the memory devices would allow increased performance and/or power efficiency by avoiding transmission of data across the interface to the host processor.
A method, comprising:
An apparatus, comprising:
A non-transitory computer-readable medium having stored thereon computer-executable instructions, execution of which by a computing device cause the computing device to perform operations comprising:
Dependencies are inferred from the claim text.