Quality of service support using stacked memory device with logic die

A method comprising:

• operating an integrated circuit (IC) device to perform memory access requests for one or more devices of a set of devices external to the IC device, the IC device comprising a set of one or more stacked memory dies comprising memory cell circuitry and comprising a set of one or more logic dies electrically coupled to the set of one or more stacked memory dies, the set of one or more logic dies comprising a quality of service (QoS) manager coupled to the memory cell circuitry of the set of one or more stacked memory dies and comprising a memory controller coupled to the QoS manager and coupled to the one or more devices;
• and
• operating the QoS manager to perform operations for a specified QoS objective.

A computer readable medium storing code which is operable to manipulate at least one computer system to perform a portion of a process to fabricate an integrated circuit (IC) device, the IC device comprising:

• a set of one or more stacked memory dies implementing memory cell circuitry;
• and
• a set of one or more logic dies electrically coupled to the memory cell circuitry, the set of one or more logic dies comprising a quality-of-service (QoS) manager and a memory controller, the memory controller coupled to the QoS manager and coupleable to a set of one or more devices sharing access to the set of one or more stacked memory dies, and the QoS manager to perform operations for a specified QoS objective.