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US 2014/0179834 A1Published application
Epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same
OwnerSeung HAN, Eun Jung LEE +1inventors
InventorsSeung HAN, Eun Jung LEE, Jong Sung KIM
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Abstract
An epoxy resin composition includes an epoxy resin including repeat units represented by Formulae 1 and 2; a curing agent; a curing accelerator; and an inorganic filler,
Claims14
An epoxy resin composition for encapsulation of a semiconductor device, the epoxy resin composition comprising:
- an epoxy resin including repeat units represented by Formulae 1 and 2;
- a curing agent;
- a curing accelerator;
- and an inorganic filler,
- wherein, in Formula 1, R1, R2, R3, R4, R5 and R6 are each independently hydrogen or a linear or branched C1 to C5 alkyl group;
- a and b are each independently an integer from 0 to 3;
- c and d are each independently an integer from 0 to 4;
- and e and f are each independently an integer from 0 to 5,
- wherein, in Formula 2, R1, R2, R3, R4, R5 and R6 are each independently hydrogen or a linear or branched C1 to C5 alkyl group;
- a and b are each independently an integer from 0 to 3;
- and c, d, e and f are each independently an integer from 0 to 4.
8 more elements
Dependencies are inferred from the claim text.