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US 2014/0179833 A1Published application
Epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same
OwnerEun Jung LEE, Jong Sung KIM +1inventors
InventorsEun Jung LEE, Jong Sung KIM, Do Won JUNG
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Abstract
A epoxy resin composition includes an epoxy resin including repeat units represented by Formulae 1 and 2; a curing agent; a curing accelerator; and an inorganic filler,
Claims14
An epoxy resin composition for encapsulation of a semiconductor device, the epoxy resin composition comprising:
- an epoxy resin including repeat units represented by Formulae 1 and 2;
- a curing agent;
- a curing accelerator;
- and an inorganic filler,
- wherein, in Formula 1, R1 and R2 are each independently hydrogen or a linear or branched C1-C5 alkyl group, and a and b are each independently an integer from 0 to 7,
- wherein, in Formula 2, R1 and R2 are each independently hydrogen or a linear or branched C1-C5 alkyl group, and a and b are each independently an integer from 0 to 4.
3 more elements
Dependencies are inferred from the claim text.