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US 2014/0179829 A1Published application
Water based epoxy resin primer
AssigneeSika Technology AG
InventorsUrs Burckhardt, Wolf-Rüdiger Huck, Reto Fässler, Antonio Corsaro
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Abstract
The present invention relates to a adhesion promoter composition containing at least one aqueous dispersion of a solid epoxy resin; at least one polyamine; and at least one Compound V in free or hydrolytically releasable form which can enter into a condensation reaction with the polyamine. Adhesion promoter compositions according to the invention lead to an improvement in the adhesion under hot, humid conditions.
Claims12
A adhesion promoter composition, containing
- at least one aqueous dispersion of a solid epoxy resin;
- at least one polyamine;
- and
- at least one compound V in free or hydrolytically releasable form, which can enter into a condensation reaction with the polyamine.
1 more element
Dependencies are inferred from the claim text.