Methods and compositions for removal of metal hardmasks
AssigneeRohm and Haas Electronic Materials LLC
InventorsDeyan Wang, Martin W. Bayes, Peter Trefonas, Kathleen M. O'connell
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AssigneeRohm and Haas Electronic Materials LLC
InventorsDeyan Wang, Martin W. Bayes, Peter Trefonas, Kathleen M. O'connell
Estimating the term…
The invention provides a process for removing a film from a substrate, said process comprising applying a composition to the film, and wherein the composition comprises at least the following: a) water; and b) at least one compound selected from the following compounds (i-v): i) NR4HF2 (Formula 1), wherein R═H, alkyl, substituted alkyl, ii) NR4F (Formula 2), wherein R═H, alkyl, substituted alkyl, iii) HF (hydrofluoric acid), iv) H2SiF6 (hexafluorosilicic acid), or v) combinations thereof. The invention also provides a composition comprising at least the following: a) water; and b) at least one compound selected from the following compounds (i-v): i) NR4HF2 (Formula 1), wherein R═H, alkyl, substituted alkyl, ii) NR4F (Formula 2), wherein R═H, alkyl, substituted alkyl, iii) HF (hydrofluoric acid), iv) H2SiF6 (hexafluorosilicic acid), or v) combinations thereof.
A process for removing a film from a substrate, said process comprising applying a composition to the film, and
A composition comprising at least the following:
Dependencies are inferred from the claim text.