Methods, apparatuses and systems for mid-plane mounting parallel optical communications modules on circuit boards

A mid-plane mounting system comprising:

• a host circuit board (CB) having at least one mounting surface, the mounting surface having at least first and second solder pads and an array of electrical contacts disposed thereon;
• a socket configured to interface a parallel optical communications module with the host CB, the socket having first and second lugs mechanically coupled therewith, the first and second lugs being secured by solder bonds to the first and second solder pads, respectively, wherein the solder bonds prevent movement of the socket relative to the host CB;
• and
• a parallel optical communications module mounted in the socket, wherein the first and second lugs abut one or more surfaces of the module and exert forces on the module in directions toward the mounting surface of the host CB to prevent movement of the module relative to the host CB.

A method for mid-plane mounting a parallel optical communications module on a host circuit board (CB), the method comprising:

• providing a host CB having at least one mounting surface, the mounting surface having at least first and second solder pads and an array of electrical contacts disposed thereon;
• providing a socket configured to interface a parallel optical communications module with the host CB, the socket including first and second lugs mechanically coupled with the socket;
• aligning the socket with the array of electrical contacts and with the first and second solder pads disposed on the mounting surface of the host CB and mounting the socket on the mounting surface of the host CB in the aligned position;
• soldering portions of the first and second lugs to the first and second solder pads, respectively, wherein the solder bonds prevent, or at least reduce, movement of the socket relative to the host CB;
• and
• mounting a parallel optical communications module in the socket such that the first and second lugs abut one or more surfaces of the module and exert forces on the module in directions toward the mounting surface of the host CB, wherein the exertion of forces on the module prevents movement of the module relative to the host CB.

An apparatus for mounting a parallel optical communications module in a plane of a mounting surface of a host circuit board (CB), the apparatus comprising:

• a socket configured to interface a parallel optical communications module with an array of electrical contacts disposed on the mounting surface of the host CB, the socket including sides and a bottom, the bottom having an upper surface and a lower surface, the upper surface of the bottom having a first array of electrical contacts thereon, the lower surface of the bottom having a second array of electrical contacts thereon, the socket having at least first and second lugs mechanically coupled therewith, the first and second lugs being configured to abut against one or more surfaces of a parallel optical communications module when the module is mounted in the socket such that the lugs prevent movement of the module relative to the host CB, and wherein the socket is configured to be secured to the mounting surface of the host CB by soldering portions of the first and second lugs to first and second solder pads, respectively, disposed on the surface of the host CB;
• and
• a cover secured to the socket such that the cover protects the first array of electrical contacts from the environment, the cover including a lug-holding mechanism for holding the first and second lugs in place while the portions of the first and second lugs are soldered to the first and second solder pads, respectively.