Wafer dicing from wafer backside

A method of dicing a semiconductor wafer comprising a plurality of integrated circuits, the method comprising:

• applying a protection tape to a wafer front side, the wafer having a dicing tape attached to the wafer backside;
• removing the dicing tape from the wafer backside;
• and, subsequently,
• applying a die attach film to the wafer backside;
• and, subsequently,
• applying a mask to the wafer backside;
• and, subsequently,
• laser scribing from the wafer backside to cut through the mask, the die attach film and the wafer, including all layers included within the front side and backside of the wafer;
• plasma etching to treat or clean surfaces of the wafer exposed by the laser scribing;
• and, subsequently,
• cleaning the wafer backside and applying a second dicing tape to the wafer backside;
• and, subsequently,
• removing the protection tape from the wafer front side.

A method of dicing a semiconductor wafer comprising a plurality of integrated circuits covered by a protection tape on a front side thereof and comprising metallization on a backside thereof, the method comprising:

• exposing a die attach film disposed on the semiconductor wafer backside;
• applying a mask to the exposed die attach film on the semiconductor wafer backside;
• laser scribing from the semiconductor wafer backside to cut through the mask, the die attach film, the metallization on the backside of the semiconductor wafer, the semiconductor wafer, and the integrated circuits on the front side of the semiconductor wafer;
• plasma etching to treat or clean surfaces of the semiconductor wafer exposed by the laser scribing;
• and
• applying a dicing tape to the laser scribed semiconductor wafer backside.