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US 2014/0179066 A1Published application
Packaging structure
AssigneeInternational Business Machines Corporation
InventorsEvan G. Colgan, Paul W. Coteus, Robert L. Wisnieff
Life of this patent
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Abstract
A method of assembling a packaging structure is provided and includes directly electrically interconnecting respective active surfaces of first and second chips in a face-to-face arrangement, electrically interconnecting at least one of the respective sidewalls of the first and second chips to a common chip and orienting the respective active surfaces of the first and second chips transversely with respect to the common chip.
Claims11
A method of assembling a packaging structure, comprising:
- directly electrically interconnecting respective active surfaces of first and second chips in a face-to-face arrangement;
- electrically interconnecting at least one of the respective sidewalls of the first and second chips to a common chip;
- and
- orienting the respective active surfaces of the first and second chips transversely with respect to the common chip.
1 more element
A method of assembling a packaging structure, comprising:
- directly electrically interconnecting respective active surfaces of first and second chips in a face-to-face arrangement such that a sidewall of the first chip is disposed in a shoulder-to-shoulder arrangement with a corresponding sidewall of the second chip;
- electrically interconnecting the sidewall of the first chip and the corresponding sidewall of the second chip to an active surface of a common chip, the sidewall of the first chip and the corresponding sidewall of the second chip being oriented transversely with respect to the respective active surfaces of the first and second chips;
- and
- orienting the respective active surfaces of the first and second chips transversely with respect to the active surface of the common chip.
1 more element
Dependencies are inferred from the claim text.