Back to results
US 2014/0179065 A1Published application
Method of manufacturing semiconductor device
AssigneeCheil Industries Inc.
InventorsKil Yong LEE, Jae Sun HAN, Jong Hyuk EUN
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a semiconductor device includes attaching a curable film to a first connection member including a first circuit terminal, attaching a conductive film to a second connection member including a second circuit terminal, and thermally compressing the first connection member to the second connection member, with the first connection member and the second connection member placed such that the curable film and the conductive film face each other.
Claims8
A method of manufacturing a semiconductor device, the method comprising:
- attaching a curable film to a first connection member including a first circuit terminal;
- attaching a conductive film to a second connection member including a second circuit terminal;
- and
- thermally compressing the first connection member to the second connection member, with the first connection member having the curable film attached thereto and the second connection member having the conductive film attached thereto placed such that the curable film and the conductive film face each other.
1 more element
Dependencies are inferred from the claim text.