Isolation Rings for Packages and the Method of Forming the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Horng Chang, Tin-Hao Kuo, Tsung-Fu Tsai, Min-Feng Ku
Life of this patent
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Abstract
A device includes a first package component, and a second package component underlying, and bonded to, the first package component. A molding material is disposed under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface. An isolation region includes a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material. The isolation has a bottom lower than the interface.
Claims20
A method comprising:
- bonding a first package component with a second package component;
- molding the second package component in a molding material;
- forming a trench penetrating through the first package component, wherein the trench extends into the molding material;
- filling an isolation material into the trench to form an isolation region;
- and
- sawing through the isolation region and the molding material to form a package, wherein the package comprises a portion of the isolation region.
A method comprising:
- bonding a plurality of dies onto a plurality of package substrates, wherein the plurality of package substrates is in a package substrate strip;
- molding the plurality of dies with a molding compound;
- forming a plurality of trenches to penetrate through the package substrate strip, wherein the plurality of trenches forms a grid;
- filling the plurality of trenches with an isolation material;
- and
- sawing the isolation material to separate the package substrate strip into a plurality of packages.
A method comprising:
- molding a die with a molding compound, wherein the die is bonded to a package substrate;
- grooving the package substrate from a first surface of the package substrate, wherein trenches formed by the grooving encircle a center portion of the package substrate, and wherein the trenches penetrate through the package substrate to extend into the molding compound;
- and
- filling the trenches with an isolation material, wherein the isolation material has a density higher than a density of the molding compound.
Dependencies are inferred from the claim text.