Thin wafer handling
AssigneeInvensas Corporation
InventorsBelgacem Haba, Ilyas Mohammed
Life of this patent
Estimating the term…
Abstract
A first area of a first surface of an encapsulated component can be thinned, the component including: a semiconductor chip having an active surface opposite the first surface, and an encapsulant extending outwardly from edges of the semiconductor chip. An entire area of the active surface may be aligned with the first area. After the abrading, a second area of the encapsulated component beyond the first area may have a thickness greater than a thickness of the first area. The second area can be configured to fully support the abraded encapsulated component in a state of the encapsulated component being manipulated by handling equipment.
Claims30
A method of thinning an encapsulated component, comprising:
- abrading a first area of a first surface of an encapsulated component to reduce a thickness of the encapsulated component within the first area, the encapsulated component including:
- a semiconductor chip having an active surface extending in a first direction and a second direction transverse to the first direction, the active surface facing in a direction opposite from that of the first surface, the semiconductor chip having a plurality of contacts at the active surface and a plurality of edges extending away from the active surface towards the first surface, and an encapsulant extending outwardly in the first and second directions from the edges of the semiconductor chip, an entire area of the active surface being aligned with the first area in the first and second directions,
- the abrading being performed such that after the abrading, a second area of the encapsulated component beyond the first area has a thickness greater than the reduced thickness, wherein the second area is configured to fully support the abraded encapsulated component in a state in which the encapsulated component is manipulated by handling equipment.
A method of forming a stacked wafer assembly, comprising:
- manipulating at least one of first and second encapsulated components so as to assemble the first and second encapsulated components to form an assembly in which surfaces of the first and second encapsulated components are juxtaposed with one another, each of the first and second encapsulated components including a plurality of semiconductor chips each having an active surface disposed in a common plane defining a common active surface, and each of the semiconductor chips having a plurality of contacts at its respective active surface, an encapsulant extending outwardly from the semiconductor chips in directions parallel to the common active surface, a first area of each encapsulated component encompassing entire areas of the plurality of semiconductor chips of the respective encapsulated component having a reduced thickness, wherein a second area of each encapsulated component disposed beyond the first area has a thickness greater than the reduced thickness, the second area fully supporting the encapsulated component during the manipulating;
- and
- processing the assembly to remove at least the second area of each encapsulated component such that the processed assembly has a thickness less than the sum of:
- the thicknesses of the encapsulated components within the respective second areas and the distance between the juxtaposed surfaces of the encapsulated components.
Dependencies are inferred from the claim text.