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US 2014/0179060 A1Published application
In situ-built pin-grid arrays for coreless substrates, and methods of making same
AssigneeIntel Corporation
InventorsMihir K. Roy, Mathew J. Manusharow
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Abstract
A coreless pin-grid array (PGA) substrate includes PGA pins that are integral to the PGA substrate without the use of solder. A process of making the coreless PGA substrate integrates the PGA pins by forming a build-up layer upon the PGA pins such that vias make direct contact to pin heads of the PGA pins.
Claims3
A process of forming a coreless pin-grid array substrate comprising:
- forming a seed layer upon a pin-grid array pin mold;
- forming a PGA precursor film on the seed layer;
- patterning the PGA precursor film to achieve a plurality of spaced-apart PGA pins;
- and
- forming a coreless PGA substrate that integrates the PGA pins including:
- forming a first interlayer to define a land side of the coreless PGA substrate, wherein the first interlayer contacts the PGA pins at pin heads thereof;
- filling a via into the first interlayer, wherein the via makes direct contact with a pin head of the PGA pins;
- and
- forming a subsequent interlayer to define near a die side of the coreless PGA substrate.
6 more elements
Dependencies are inferred from the claim text.