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US 2014/0179059 A1Published application
Package-level integrated circuit connection without top metal pads or bonding wire
AssigneeMosaid Technologies Incorporated
InventorHong Beom PYEON
Life of this patent
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Abstract
An integrated circuit method is provided with package-level connectivity, between internal electronic circuitry thereof and contact points on a package substrate thereof, without requiring top metal pads or bonding wires.
Claims7
A method of producing an integrated circuit apparatus, comprising:
- providing electronic circuitry within a wafer;
- sawing the wafer to produce an integrated circuit apparatus that contains said electronic circuitry and has an edge produced by said sawing;
- and
- providing within the wafer a plurality of conductors connected to said electronic circuitry and positioned to be exposed on said edge by said sawing to make said conductors physically accessible on said edge.
1 more element
A method of producing an integrated circuit apparatus, comprising:
- providing electronic circuitry and a plurality of conductors connected to said electronic circuitry;
- providing a package substrate including a plurality of conductive contacts;
- and
- connecting respective ones of said conductors to respective ones of said contacts by respective vias that are physically attached to the associated conductors and contacts.
1 more element
Dependencies are inferred from the claim text.