Apparatus and method for manufacturing thin film encapsulation
AssigneeSamsung Display Co., Ltd.
InventorsMyung-Soo Huh, Jeong-Ho Yi, Yong-Suk Lee
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Abstract
An apparatus and method for manufacturing a thin film encapsulation includes: a first cluster configured to form a first inorganic layer on a display substrate using a sputtering process; a second cluster configured to form a first organic layer on the first inorganic layer on the display substrate using a monomer deposition process; and a third cluster configured to form a second inorganic layer on the first organic layer on the display substrate using a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process.
Claims36
A thin film encapsulation manufacturing apparatus comprising:
- a first cluster configured to form a first inorganic layer on a display substrate using a sputtering process;
- a second cluster configured to form a first organic layer on the first inorganic layer on the display substrate using a monomer deposition process;
- and
- a third cluster configured to form a second inorganic layer on the first organic layer on the display substrate using a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process.
A method of manufacturing a thin film encapsulation, the method comprising:
- forming a first inorganic layer on a display substrate using a sputtering process;
- forming a first organic layer on the first inorganic layer using a monomer deposition process;
- and
- forming a second inorganic layer on the first organic layer using a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process.
Dependencies are inferred from the claim text.