Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices

A system for fabricating an encapsulated electronic device comprising a base substrate having arranged thereon an electronic device, said electronic device being covered by an encapsulation for protecting the electronic device from moisture and/or oxygen, wherein the encapsulation comprises a multilayer barrier film capable of encapsulating a moisture and/or oxygen sensitive electronic or optoelectronic device, said multilayer barrier film comprising:

• at least one nanostructured layer comprising reactive nanoparticles capable of interacting with moisture and/or oxygen, and inert nanoparticles which do not interact with moisture and/or oxygen and which are adapted to obstruct the permeation of moisture and/or oxygen, said reactive nanoparticles and inert nanoparticles being distributed within a polymeric binder, and at least one ultraviolet light neutralizing layer comprising a material capable of absorbing ultraviolet light, thereby limiting the transmission of ultraviolet light through the multilayer barrier film, said system comprising:
• a vacuum chamber having arranged therein,
• a holding jig for receiving an electronic device to be encapsulated,
• a loadlock connected to the vacuum chamber, said loadlock being adapted to transport the sample onto the holding jig,
• a plasma source for cleaning the electronic device to be encapsulated,
• a plurality of material sources adapted to form said multilayer barrier film onto the electronic device,
• a linear motion drive capable of applying a normal force onto a sample on the holding jig,
• a heater coupled to the holding jig for heating the electronic device, and
• a UV source for curing the multilayer barrier film.