Method for manufacturing light emitting diode module
AssigneeHon Hai Precision Industry Co., Ltd.
InventorCHIH-CHEN LAI
Life of this patent
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Abstract
A method for manufacturing an LED module includes following steps: providing a SMT (Surface Mount Technology) apparatus having a CCD (Charge-Coupled Device) image sensor and a nozzle, and providing a PCB and fixing the PCB in the SMT apparatus; providing a plurality of LEDs and mounting the LEDs on the PCB by the SMT apparatus; providing a plurality of lenses each having a plurality of patterned portions formed on an outer face of the lens, and the CCD image sensor imaging the lens and identifying the patterned portions, and then the SMT apparatus obtaining a location of the lens relative to the LED; positioning the lens on the PCB to cover the LED by the SMT apparatus; and fixing the lens on the PCB.
Claims20
A method for manufacturing a light emitting diode (LED) module, comprising following steps:
- providing a SMT (Surface Mount Technology) apparatus having a CCD (Charge-Coupled Device) image sensor and a nozzle, and providing a PCB and fixing the PCB in the SMT apparatus;
- providing a plurality of LEDs and mounting the LEDs on the PCB by the SMT apparatus;
- providing a plurality of lenses each having a plurality of patterned portions formed on an outer face of the lens, and the CCD image sensor imaging the lens and identifying the patterned portions, and then the SMT apparatus obtaining a location of the lens relative to the LED;
- positioning the lens on the PCB to cover the LED by the SMT apparatus;
- and
- fixing the lens on the PCB.
A method for manufacturing an LED module, comprising following steps:
- providing a SMT (Surface Mount Technology) apparatus having a first CCD (Charge-Coupled Device) image sensor, a second CCD image sensor, and a nozzle, and providing a PCB and fixing the PCB in the SMT apparatus;
- providing a plurality of LEDs and mounting the LEDs on the PCB by the SMT apparatus;
- providing a plurality of lenses each having a plurality of patterned portions formed on an outer face of the lens, and the first CCD image sensor imaging the lens, and then the SMT apparatus obtaining a location of each lens relative to a corresponding LED;
- positioning the lens on the PCB to cover the corresponding LED by the SMT apparatus;
- imaging the lens and identifying the patterned portions by the second CCD image sensor, and adjusting a position of the lens relative to the corresponding LED by the SMT apparatus;
- and
- fixing the lens on the PCB.
Dependencies are inferred from the claim text.