Method for manufcturing backlight module

A method for manufacturing a backlight module, comprising the following steps:

• providing a substrate having two electrodes on a top surface thereof;
• providing a flip chip LED (light emitting diode) and mounting the flip chip LED on the top surface of the substrate to have the flip chip LED electrically connect with the two electrodes of the substrate;
• providing a frame and mounting the frame on the top surface of the substrate, a through hole defined in the frame, the through hole receiving the flip chip LED therein, the flip chip LED located at a bottom end of the through hole;
• and
• providing a phosphor layer and mounting the phosphor layer on a top end of the frame away from the substrate to make the phosphor layer cover a top end of the through hole and the flip chip LED;
• wherein the phosphor layer is an elongated plate and has a uniform thickness, the phosphor layer entirely covers a top end of the through hole, and a space is defined between a bottom surface of the phosphor layer and the top end of the through hole.