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US 2014/0179034 A1Published application
Semiconductor photonic package
AssigneeInternational Business Machines Corporation
InventorsTymon Barwicz, Paul F. Fortier, Stephane G. Harel, Yurii A. Vlasov
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Abstract
A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.
Claims13
A method for assembling a semiconductor photonic package device, the method comprising:
- bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion;
- bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion;
- and
- disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.
1 more element
Dependencies are inferred from the claim text.