Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods

7-9. (canceled)

A packaged semiconductor die, comprising:

• a die having an active side and a non-active side facing away from the active side, and a plurality of contact structures carried by the active side;
• and
• a package having a wafer side facing the die, an inquiry side facing away from the wafer side, a plurality of wafer side contact sites carried by the package at the wafer side of the package, and a plurality of nanospikes carried by at least one wafer side contact site, the nanospikes being connected to the contact structures of the die by intermetallic bonds.

The apparatus of claim 14 wherein the nanospikes are approximately 0.3-2 μm long.

A method for testing a device under test, comprising:

• placing the device under test to face a package, wherein the device under test carries a plurality of contact structures, wherein the package has a wafer side facing the device under test and an inquiry side facing away from the wafer side, and wherein the wafer side of the package has a plurality of wafer side contact sites with nanospikes;
• and
• contacting one or more contact structures of the device under test with nanospikes carried by the wafer side contact sites.

(canceled)

(canceled)