Electroconductive material, and connection method and connection structure using the same
AssigneeMurata Manufacturing Co., Ltd.
InventorsKosuke Nakano, Hidekiyo Takaoka
Life of this patent
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Abstract
An electroconductive material that includes a metal component containing a first metal and a second metal having a higher melting point than the first metal, and has a configuration in which the first metal is Sn or an alloy containing Sn, and the second metal is a Cu—Al alloy which forms, with the first metal, an intermetallic compound exhibiting a melting point of 310° C. or higher. The first metal can be Sn alone or an alloy containing Sn and at least one of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Pd, Si, Sr, Te, and P.
Claims16
An electroconductive material including a metal component containing a first metal and a second metal having a higher melting point than the first metal,
- wherein the first metal is Sn or an alloy containing Sn, and
- the second metal is a Cu—Al alloy which forms, with the first metal, an intermetallic compound having a melting point of 310° C. or higher.
Dependencies are inferred from the claim text.