Resin composition, copper-clad laminate and printed circuit board for use therewith
AssigneeElite Material Co., Ltd.
InventorsLI-CHIH YU, TSE-AN LEE
Life of this patent
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Abstract
A resin composition includes (A) an epoxy resin; (B) a benzoxazine (BZ) resin; (C) a styrene maleic anhydride (SMA) copolymer; and (D) a polyester. The resin composition includes specific ingredients of a polyester and is characterized by specific proportions thereof so as to achieve a low delta Tg value of copper clad laminates manufactured in accordance with the resin composition and attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high fire retardation of the copper clad laminates and printed circuit boards manufactured in accordance with the resin composition.
Claims10
A resin composition, comprising:
- (A) an epoxy resin;
- (B) a benzoxazine (BZ) resin;
- (C) a styrene maleic anhydride (SMA) copolymer;
- and
- (D) a polyester.
A resin composition, comprising:
- (A) 100 parts by weight of an epoxy resin;
- (B) 10 to 80 parts by weight of a benzoxazine (BZ) resin;
- (C) 5 to 100 parts by weight of a styrene maleic anhydride (SMA) copolymer;
- and
- (D) 5 to 100 parts by weight of a polyester.
Dependencies are inferred from the claim text.