Film for flip chip type semiconductor back surface and its use
AssigneeNitto Denko Corporation
InventorsNaohide TAKAMOTO, Goji SHIGA, Fumiteru ASAI
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Abstract
The present invention relates to a film for flip chip type semiconductor back surface, which is to be disposed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface including an adhesive layer and a protective layer laminated on the adhesive layer, in which the protective layer is constituted of a heat-resistant resin having a glass transition temperature of 200° C. or more or a metal.
Claims4
A film for flip chip type semiconductor back surface, which is to be disposed on a back surface of a semiconductor element flip chip-connected onto an adherend,
- the film for flip chip type semiconductor back surface comprising an adhesive layer and a protective layer laminated on the adhesive layer,
- wherein a tensile storage elastic modulus of the adhesive layer in an uncured state at 23° C. is 1 GPA to 50 GPa,
- wherein the protective layer is composed of a metal,
- wherein the metal is at least one selected from the group consisting of aluminum, aluminate, stainless steel, iron, titanium, tin and copper, and
- wherein a surface of the protective layer on the adhesive layer side has been subjected to a surface activation treatment.
Dependencies are inferred from the claim text.