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US 2014/0178678 A1Published application
Encapsulating sheet
AssigneeNitto Denko Corporation
InventorsHiroyuki KATAYAMA, Ryota MITA, Ryuichi KIMURA, Hisataka ITO
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Abstract
An encapsulating sheet, for encapsulating an optical semiconductor element, includes an embedding layer for embedding the optical semiconductor element and a gas barrier layer provided at one side in a thickness direction of the embedding layer, having a thickness of 50 μm or more and 1,000 μm or less, and for suppressing the passing of a gas in the thickness direction.
Claims6
An encapsulating sheet, for encapsulating an optical semiconductor element, comprising:
- an embedding layer for embedding the optical semiconductor element and
- a gas barrier layer provided at one side in a thickness direction of the embedding layer, having a thickness of 50 μm or more and 1,000 μm or less, and for suppressing the passing of a gas in the thickness direction.
Dependencies are inferred from the claim text.