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US 2014/0178677 A1Published application
Encapsulating sheet
AssigneeNitto Denko Corporation
InventorsHirokazu MATSUDA, Haruka ONA
Life of this patent
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Abstract
An encapsulating sheet, for encapsulating an optical semiconductor element, includes an embedding layer for embedding the optical semiconductor element, a covering layer disposed at one side in a thickness direction with respect to the embedding layer, and a barrier layer interposed between the embedding layer and the covering layer; having a thickness of 50 μm or more and 1,000 μm or less; and for suppressing a transfer of a component contained in the covering layer to the embedding layer.
Claims3
An encapsulating sheet, for encapsulating an optical semiconductor element, comprising:
- an embedding layer for embedding the optical semiconductor element,
- a covering layer disposed at one side in a thickness direction with respect to the embedding layer, and
- a barrier layer interposed between the embedding layer and the covering layer;
- having a thickness of 50 μm or more and 1,000 μm or less;
- and for suppressing a transfer of a component contained in the covering layer to the embedding layer.
2 more elements
Dependencies are inferred from the claim text.