Composition for encapsulation and encapsulated apparatus including the same
AssigneeCheil Industries Inc.
InventorsKyoung Jin HA, Ji Hye KWON, Seong Ryong NAM, Yeon Soo LEE, Chang Min LEE, Seung Jib CHOI
Life of this patent
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Abstract
A composition for encapsulation and an encapsulated apparatus, the composition including a (meth)acrylic alkoxysilane monomer including a moiety represented by Formula 1 or 2, below, or an oligomer thereof; a multifunctional (meth)acrylate monomer or an oligomer thereof; and an initiator, wherein * and ** represent a binding site between elements.
Claims20
A composition for encapsulation, comprising:
- a (meth)acrylic alkoxysilane monomer including a moiety represented by Formula 1 or 2, below, or an oligomer thereof;
- a multifunctional (meth)acrylate monomer or an oligomer thereof;
- and
- an initiator,
- wherein * and ** represent a binding site between elements.
A composition for encapsulation having a curing shrinkage of about 10% or less, a storage modulus after curing of about 5 GPa to about 20 GPa, and an adhesive strength to an inorganic barrier layer after curing of about 20 kgf/(mm)2 to about 100 kgf/(mm)2, wherein the composition includes:
- a (meth)acrylic alkoxysilane monomer including a moiety represented by Formula 1 or 2, below, or an oligomer thereof, and
- a multifunctional (meth)acrylate monomer or an oligomer thereof,
- wherein * and ** represent a binding site between elements.
Dependencies are inferred from the claim text.