Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same
AssigneeElite Electronic Material (Zhongshan) Co., Ltd.
InventorsCHANG-YUAN LI, YI-JEN CHEN, HONG-XIA PENG
Life of this patent
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Abstract
A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.
Claims10
A halogen-free resin composition, comprising:
- (A) 100 parts by weight of epoxy resin;
- (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer;
- and
- (C) 5 to 50 parts by weight of bisphenol S.
Dependencies are inferred from the claim text.