Low firing temperature copper composition

Abstract

An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m2/g, second copper particles having a specific surface area of about 0.5-2.5 m2/g, glass frit and an organic vehicle. According to another embodiment of the invention, the first copper particles are about 60-80 wt. % of the paste, while the content of the second copper particles is up to about 20 wt. % of the paste. According to another embodiment, the glass frit is lead-free and is about 1-10 wt. % of the paste. Preferably, the glass frit comprises a boron-zinc-barium oxide glass frit. According to another embodiment, the paste further comprises copper oxide. Another embodiment of the invention relates to an electroconductive paste comprising about 60-95 wt. % copper component, a boron-zinc-barium oxide glass frit, and an organic vehicle.

Dependencies are inferred from the claim text.