US 2014/0178566 A1Published application

Pattern forming apparatus and method, and method of manufacturing substrate formed with pattern

AssigneeFUJIFILM Corporation

InventorJun KODAMA

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Abstract

A pattern forming apparatus includes: a laser irradiation device configured to emit and direct a beam of laser light to enter a hole through an opening section thereof formed in a substrate; a light reflection device having a reflective surface configured to reflect the laser light to irradiate an inner surface of the hole with the reflected laser light, the reflective surface being arranged on a bottom of the hole to face toward the opening section; a droplet ejection device configured to eject and deposit droplets of conductive ink into the hole; and a control device configured to control the laser irradiation device to irradiate and modify the inner surface of the hole with the laser light reflected on the reflective surface, and to control the droplet ejection device to eject and deposit the droplets of the conductive ink into the hole of which the inner surface has been modified.

Claims20

Dependent claims

A pattern forming apparatus, comprising:

a data acquisition device configured to acquire laser irradiation data and droplet deposition data in accordance with shape information of a substrate that has been formed with a hole;
a laser irradiation device configured to emit and direct a beam of laser light to enter the hole through an opening section thereof;
a light reflection device having a reflective surface configured to reflect the laser light entering the hole through the opening section thereof to irradiate an inner surface of the hole with the reflected laser light, the reflective surface being arranged on a bottom of the hole to face toward the opening section thereof;
a droplet ejection device configured to eject and deposit droplets of conductive ink into the hole;
and
a control device configured to control the laser irradiation device in accordance with the laser irradiation data to irradiate and modify the inner surface of the hole with the laser light reflected on the reflective surface, and to control the droplet ejection device in accordance with the droplet deposition data to eject and deposit the droplets of the conductive ink into the hole of which the inner surface has been modified.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/191,157Filed 26 Feb 2014
Priority: JP 2011-18630029 Aug 2011
Published: 26 Jun 2014
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

H05K 3/422
Plated through-holes or plated via connections: characterised by electroless plating method; pretreatment therefor
H05K 3/0032
By laser ablation: of organic insulating material
H05K 3/4069
By thick-film techniques: for via connections in organic insulating substrates
H05K 2201/09854
Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809: hole or via having special cross-section, e.g. elliptical