Optical photonic circuit coupling

A method comprising:

• forming a buried oxide layer upon a silicon substrate;
• forming a silicon waveguide structure on the buried oxide layer;
• etching an angular surface at a first end of the silicon waveguide structure;
• metalizing the angular surface;
• depositing an oxide layer over the buried oxide layer and the silicon waveguide structure;
• forming a tapered via in the oxide layer having a narrow end and a wide end, the narrow end disposed above the angular surface, the tapered via extending from the narrow end in a direction perpendicular to the silicon waveguide structure;
• and
• filling the tapered via with a polymer.

An apparatus comprising:

• connector body having a horizontal surface and a vertical surface;
• an array of fiber holes extending through the connector body from the horizontal surface to the vertical surface;
• one or more optical fibers extending through each of the fiber holes from the horizontal surface to the vertical surface;
• a microlens array terminating one or more of the fiber holes at the horizontal surface;
• and
• one or more alignment structures along the horizontal surface to align the microlens array with an array of tapered waveguides on a photonic substrate.

A method comprising:

• fabricating a connector body having an array of fiber holes extending through the connector body from a horizontal surface to a vertical surface;
• placing one or more optical fibers through each of the fiber holes from the horizontal surface to the vertical surface;
• and
• terminating one or more of the fiber holes at the horizontal surface with a microlens array;
• wherein the connector has one or more alignment structures along the horizontal surface to align the microlens array with an array of tapered waveguides on a photonic substrate.