Method of final defect inspection

A method of final defect inspection, comprising steps of:

• preparing a final defect inspection apparatus, which comprises a host device having a database, a microscope, a bar code scanner connected to the host device, a support tool for supporting a circuit board to be inspected, a signal transceiver provided on the support tool and electrically connected to the host device, a signal transmitter provided on a support plate of the microscope and electrically connected to the signal transceiver and the host device, and a foot pedal electrically connected to the signal transmitter;
• calibrating the final inspection apparatus by aligning a cross region seen from the microscope and the signal transmitter and then stamping the foot pedal, wherein the microscope is positioned to correspond with the signal transmitter, and the signal transmitter transmits a positioning signal to the host device;
• scanning a bar code on the circuit board by using the bar code scanner, wherein the host device selects data and a circuit layout diagram from the database corresponding to the bar code;
• calibrating an original point by moving the support plate of the microscope until the cross region seen from the microscope is aligned with two points of a diagonal line on the circuit board provided on the support tool, and then stamping the foot pedal to generate a plurality of original aligned positions, wherein the signal transceiver receives and transmits the original aligned positions to the host device, and the host device defines an outline of the circuit board based on the original aligned positions and the circuit layout diagram, and specifies one point on the circuit board as the original point;
• inspecting any defect by moving the support plate and using an eye lens and at least one object lens of the microscope to inspect whether any defect exists in a plurality of inspection regions preset on the circuit board, wherein a defect position is the inspection region where any defect is found is specified;
• confirming the defect position by aligning the cross region seen from the microscope and each defect position, and then stamping the foot pedal to generate a defect aligned position or a plurality of defect aligned positions;
• and
• generating a shipment file by using the host device to calculate each coordinate of a scrap region based on a relative position between the original point and each defect aligned position, and to generate a shipment file containing each coordinate of the scrap region.