Electro-optical assembly including a glass bridge
AssigneeIntel Corporation
InventorsPeter L.D. Chang, Edris M. Mohammed, Henning Braunisch, Hengju Cheng
Life of this patent
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Abstract
Embodiments of the present disclosure provide techniques and configurations for routing signals of an electro-optical assembly using a glass bridge. In one embodiment, an electro-optical assembly includes a laser die having a laser device and a glass bridge electrically coupled with the laser die by one or more interconnect structures, the glass bridge including electrical routing features configured to route electrical signals to the laser die from a transmitter device. Other embodiments may be described and/or claimed.
Claims25
An electro-optical assembly, the assembly comprising:
- a laser die having a laser device;
- and
- a glass bridge electrically coupled with the laser die by one or more interconnect structures, the glass bridge including electrical routing features configured to route electrical signals to the laser die from a transmitter device.
A method of fabricating an electro-optical assembly, the method comprising:
- providing a laser die having a laser device;
- and
- coupling a glass bridge with the laser die using one or more interconnect structures, the glass bridge including electrical routing features configured to route electrical signals to the laser die from a transmitter device.
A system comprising:
- a processor;
- and
- an electro-optical (EO) assembly coupled with the processor, the EO assembly comprising:
- a laser die having a laser device;
- and
- a glass bridge electrically coupled with the laser die by one or more interconnect structures, the glass bridge including electrical routing features configured to route electrical signals to the laser die from a transmitter device, wherein the electrical signals are based on input/output (I/O) signals of the processor.
Dependencies are inferred from the claim text.