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US 2014/0177222 A1Published application
Semiconductor photonic package
AssigneeInternational Business Machines Corporation
InventorsTymon Barwicz, Paul F. Fortier, Stephane G. Harel, Yurii A. Vlasov
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Abstract
A method for assembling a semiconductor photonic package device includes bonding a portion of a first surface of a semiconductor die portion to a portion of a carrier portion, bonding a single mode optical ferrule portion to a portion of the first surface of the semiconductor die portion, and disposing a cover plate assembly in contact with the optical ferrule portion and the carrier portion.
Claims8
1-13. (canceled)
A semiconductor photonic package device comprising:
- a carrier portion having a first planar surface and a cavity communicative with the first planar surface;
- a semiconductor die portion having a first planar surface, the first planar surface of the semiconductor die portion disposed on the first planar surface of the carrier portion;
- and
- a single mode optical ferrule portion partially disposed on the first planar surface of the semiconductor die portion;
- and
- a cover portion arranged in contact with the first planar surface of the optical ferrule portion.
3 more elements
Dependencies are inferred from the claim text.