Dbf film as a thermal interface material
AssigneeIntel Corporation
InventorsHitesh Arora, Mihir A. Oka, Chandra M. Jha
Life of this patent
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Abstract
A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.
Claims17
A die backside film comprising:
- a matrix material;
- and
- an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles.
A method comprising:
- introducing a die backside film on a backside surface of a die, the die backside film comprising a matrix material comprising an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles;
- and
- disposing the die in a package.
An apparatus comprising:
- a package comprising a microprocessor disposed in a carrier, the microprocessor comprising a first side and an opposite second side comprising a device side;
- a die backside film on the first side of the microprocessor, comprising a matrix material comprising an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles;
- and
- a printed circuit board coupled to at least a portion of the plurality of conductive posts of the carrier.
Dependencies are inferred from the claim text.