Core substrate and method for manufacturing the same, and substrate with built-in electronic components and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung Eun Lee, Yee Na SHIN, Yul Kyo CHUNG, Doo Hwan LEE
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Abstract
The present invention relates to a core substrate, a manufacturing method thereof, and a substrate with built-in electronic components and a method for manufacturing the same. In accordance with an embodiment of the present invention, a core substrate including: a first insulating layer; and a second insulating layer stacked on upper and lower surfaces of the first insulating layer and made of a material with a glass transition temperature lower than that of the first insulating layer.
Claims15
A core substrate comprising:
- a first insulating layer;
- and
- a second insulating layer stacked on upper and lower surfaces of the first insulating layer and made of a material with a glass transition temperature lower than that of the first insulating layer.
A substrate with built-in electronic components comprising:
- a core substrate provided with a cavity and including a first insulating layer and a second insulating layer stacked on upper and lower surfaces of the first insulating layer, wherein the second insulating layer is made of a material with a glass transition temperature lower than that of the first insulating layer;
- and
- an electronic component fixed by an insulating material flown from the first insulating layer by being inserted into the cavity.
A method for manufacturing a substrate with built-in electronic components, comprising:
- preparing a core substrate provided with a cavity and including a first insulating layer and a second insulating layer stacked on upper and lower surfaces of the first insulating layer, wherein the second insulating layer is made of a material with a glass transition temperature lower than that of the first insulating layer;
- inserting the electronic component into the cavity;
- and
- fixing the electronic component by flowing an insulating material of the first insulating layer into a gap between the cavity and the electronic component by thermal compressing the core substrate inserted therein the electronic component.
Dependencies are inferred from the claim text.