Laser encapsulation of multiple dissimilar devices on a substrate

An apparatus comprising:

• a first substrate;
• a first device and a second device disposed on the first substrate;
• and
• a second substrate, wherein
• the first substrate, the second substrate, and a metal ring enclose the first device in a first atmosphere, and the first substrate, the second substrate, and an other metal ring enclose the second device in a second atmosphere different from the first atmosphere.

An apparatus comprising:

• a substrate;
• a first device and a second device disposed on the substrate;
• a cover;
• first means for enclosing the first device in a first cavity in a first atmosphere defined by the substrate, the cover, and the first enclosing means;
• and
• second means for enclosing the second device in a second cavity in a second atmosphere defined by the substrate, the cover, and the second enclosing means, wherein the second atmosphere is different from the first atmosphere.

An apparatus comprising:

• a process chamber including:
• a chamber wall;
• a window, wherein the chamber wall and the window enclose the process chamber to provide a controlled atmosphere inside the process chamber;
• and
• a platform for supporting a substrate;
• and
• a laser outside the process chamber and configured to emit electromagnetic radiation through the window into the process chamber.