Electromagnetic Interference Shielding and Strain Relief Structures For Coupled Printed Circuits

Apparatus, comprising:

• a first printed circuit having first signal paths;
• a second printed circuit having second signal paths;
• electrical connection structures that couple the first and second signal paths;
• and
• molded plastic strain relief structures, wherein the electrical connection structures and portions of the first and second printed circuits are embedded within the molded plastic strain relief structures.

A method of coupling first and second printed circuits, comprising:

• forming first metal contacts on the first printed circuit that are coupled to signal paths in the first printed circuit;
• forming second metal contacts on the second printed circuit that are coupled to signal paths in the second printed circuit;
• placing a layer of anisotropic conductive film between the first and second metal contacts;
• and
• molding plastic over the first and second printed circuits while pressing together the first and second printed circuits to form electrical connections between the first and second metal contacts through the anisotropic conductive film.

A method of coupling first and second printed circuits, comprising:

• forming first metal contacts on the first printed circuit that are coupled to signal paths in the first printed circuit;
• forming second metal contacts on the second printed circuit that are coupled to signal paths in the second printed circuit;
• placing a layer of anisotropic conductive film between the first and second metal contacts;
• placing a plastic ring between the first and second printed circuits, wherein the plastic ring surrounds the first and second metal contacts and the layer of anisotropic conductive film;
• and
• heating and pressing together the first and second printed circuits to form electrical connections between the first and second metal contacts through the anisotropic conductive film while bonding the plastic ring to the first and second printed circuits.

Apparatus, comprising:

• a first printed circuit having first signal paths;
• a second printed circuit having second signal paths;
• electrical connection structures that couple the first and second signal paths;
• and
• an elastomeric plastic ring surrounding the electrical connection structures and bonded to the first and second printed circuits.

A method of coupling first and second printed circuits, comprising:

• forming first metal contacts on the first printed circuit that are coupled to signal paths in the first printed circuit;
• forming second metal contacts on the second printed circuit that are coupled to signal paths in the second printed circuit;
• placing solder paste between the first and second metal contacts;
• and
• molding plastic over the first and second printed circuits while heating and pressing together the first and second printed circuits to reflow the solder paste and form solder joints between the first and second contacts.

A method of coupling first and second printed circuits, comprising:

• forming first metal contacts on the first printed circuit that are coupled to signal paths in the first printed circuit;
• forming second metal contacts on the second printed circuit that are coupled to signal paths in the second printed circuit;
• placing solder paste between the first and second metal contacts;
• placing a plastic ring between the first and second printed circuits, wherein the plastic ring surrounds the first and second metal contacts;
• and
• heating and pressing together the first and second printed circuits to reflow the solder paste and form solder joints between the first and second contacts while bonding the plastic ring between the first and second printed circuits.