Wiring substrate, electronic device, and electronic module
AssigneeKYOCERA Corporation
InventorMasatsugu Iiyama
Life of this patent
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Abstract
A wiring substrate comprises an insulating substrate and an external electrode on the insulating substrate. The insulating substrate comprises a lateral surface comprising a cutout. The cutout extends to a lower surface of the insulating substrate. The external electrode extends from an inner surface of the cutout to the lower surface of the insulating substrate. The insulating substrate comprises a protrusion at a lower end portion of the inner surface of the cutout. The protrusion protrudes from the inner surface of the cutout toward the lateral surface of the insulating substrate.
Claims8
1-7. (canceled)
A wiring substrate comprising:
- an insulating substrate comprising a lateral surface that comprises a cutout, the cutout extending to a lower surface of the insulating substrate;
- and
- an external electrode extending from an inner surface of the cutout to the lower surface of the insulating substrate,
- wherein the insulating substrate comprises a protrusion at a lower end portion of the inner surface of the cutout, and
- the protrusion protrudes from the inner surface of the cutout toward the lateral surface of the insulating substrate.
Dependencies are inferred from the claim text.