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US 2014/0177167 A1Published application
Heat dissipation device
AssigneesHon Hai Precision Industry Co., Ltd., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
InventorXIAN-XIU TANG
Life of this patent
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Abstract
A heat dissipation device includes a heat sink and an air duct mounted to the heat sink. The heat sink includes a board and a number of fins extending up from the board. The air duct includes an installation piece pivotably mounted to a side of the heat sink, and a blocking piece extending substantially perpendicularly out from an end of the installation piece.
Claims10
A heat dissipation device for dissipating heat generated by a central processing unit (CPU), comprising:
- a heat sink mounted above the CPU, the heat sink comprising a board and a plurality of fins extending up from the board;
- and
- an air duct mounted to the heat sink, the air duct comprising a first plate, the first plate comprising an installation piece mounted to a side of the heat sink, and a blocking piece extending out from the installation piece in an angled manner.
An electronic device, comprising:
- a motherboard comprising a first electronic component and a second electronic component located at a side of the first electronic component;
- a heat sink comprising a board mounted on the motherboard above the first electronic device, and a plurality of fins extending up from the board;
- and
- an air duct comprising an installation piece mounted to a side of the heat sink and substantially parallel to the plurality of fins, and a blocking piece extending at an angle out from the installation piece, wherein the installation piece is located between the first and second electronic components, and the blocking piece extends away from the heat sink.
1 more element
Dependencies are inferred from the claim text.