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US 2014/0177158 A1Published application
Thermal matched composite die
AssigneeIntel Corporation
InventorsAleksandar Aleksov, Shawna M. Liff
Life of this patent
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Abstract
A thermal matched composite material, suitable for use as a die is described. In one example, the material includes a metal plate and a substrate having a coefficient of thermal expansion (CTE) lower than the metal plate to carry microelectronic circuits. An adhesive layer between the substrate and the metal plate physically attaches the metal plate to the substrate so that the combined metal plate and substrate have a higher CTE than the substrate alone.
Claims20
An apparatus comprising:
- a metal plate;
- a substrate having a coefficient of thermal expansion (CTE) lower than the metal plate to carry microelectronic circuits;
- and
- an adhesive layer between the substrate and the metal plate to physically attach the metal plate to the substrate so that the combined metal plate and substrate have a higher CTE than the substrate alone.
1 more element
A method comprising:
- applying a first adhesive layer to a metal plate;
- and
- applying a second adhesive layer to a substrate, the substrate to carry solder and metal layers and having a coefficient of thermal expansion (CTE) lower than the metal plate;
- and
- pressing the first adhesive layer to the second adhesive layer to attach the substrate to the metal plate at temperature lower than a melting point of the solder and the metal layers so that the combined metal plate and substrate have a higher CTE than the substrate alone.
2 more elements
An apparatus comprising:
- a communications chip;
- a mass memory;
- and
- a processor formed on a packaged die, having a metal plate, a substrate having a coefficient of thermal expansion (CTE) lower than the metal plate to carry microelectronic circuits, and an adhesive layer between the substrate and the metal plate to physically attach the metal plate to the substrate so that the combined metal plate and substrate have a higher CTE than the substrate alone.
1 more element
Dependencies are inferred from the claim text.