Overmolded Composite Structure for an Electronic Device
AssigneeTicona LLC
InventorsRong Luo, Xinyu Zhao
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Abstract
An overmolded composite structure that contains a metal component and a resinous component adhered to a surface thereof is provided. The resinous component is formed from a thermoplastic composition that contains at least one polyarylene sulfide and at least one mineral filler. The present inventors have discovered that the nature and relative concentration of the polyarylene sulfides, mineral fillers, and/or other materials in the thermoplastic composition can be selectively tailored so that the resulting resinous component has a coefficient of linear thermal expansion and/or color that is similar to the metal component.
Claims20
1-37. (canceled)
An overmolded composite structure for an electronic device, the composite structure comprising:
- a metal component that defines a surface, wherein the metal component includes magnesium or an alloy thereof;
- a resinous component that is adhered to the surface of the metal component, wherein the resinous component is formed from a thermoplastic composition that comprises polyphenylene sulfide and a mineral filler, wherein the mineral filler includes talc, mica, or a combination thereof.
Dependencies are inferred from the claim text.