Reduction of underfill filler settling in integrated circuit packages

A method, comprising:

• forming an interconnect structure between a die and an integrated circuit substrate, the interconnect structure being configured to route electrical signals between the die and the integrated circuit substrate;
• depositing an underfill material between the die and the integrated circuit substrate to form a package, the underfill material comprising a plurality of filler particles, wherein the underfill material surrounds at least a portion of the interconnect structure;
• and
• reducing an electrostatic charge on one or more of the underfill material and the interconnect structure.

A method, comprising:

• forming an interconnect structure between a die and an integrated circuit substrate, the interconnect structure being configured to route electrical signals between the die and the integrated circuit substrate;
• depositing an underfill material between the die and the integrated circuit substrate to form a package, the underfill material comprising a plurality of filler particles, wherein the underfill material surrounds at least a portion of the interconnect structure;
• and
• applying an electric or magnetic field to the package, wherein the electric or magnetic field exerts a force against the filler particles in a direction generally opposite to a direction of gravitational force.

A computing device comprising:

• a motherboard;
• a communication chip mounted on the motherboard;
• and
• a processor mounted on the motherboard, the processor comprising:
• an integrated circuit substrate;
• a die;
• an interconnect structure disposed between the integrated circuit substrate and the die, the interconnect structure being configured to route electrical signals between the die and the integrated circuit substrate;
• and
• an underfill layer disposed around the interconnect structure between the die and the integrated circuit substrate, the underfill layer comprising filler particles, wherein at least some of the filler particles are disposed at an interface between the die and the underfill layer.