US 2014/0177106 A1 · SUSPENSION BOARD WITH CIRCUITS AND METHOD FOR MANUFACTURING THE SAME

Abstract

A thick portion having a first thickness and a thin portion having a second thickness on a base insulating layer are formed on a conductive support substrate. The second thickness is smaller than the first thickness. A boundary surface is formed between an upper surface of the thick portion and an upper surface of the thin portion. A boundary line between the upper surface of the thick portion and the boundary surface extends in a first direction. Write wiring traces and read wiring traces are formed to extend on the thick portion and the thin portion of the base insulating layer. The lateral sides of the write wiring traces and the read wiring traces extend in a second direction that intersects with the first direction, and the second direction forms an angle of not less than 60 degrees and not more than 90 degrees with the first direction.

Claims10

Dependent claims

A suspension board with circuits, comprising:

a support substrate formed of a conductive material;
an insulating layer that is formed on the support substrate, and includes a first portion having a first thickness and a second portion having a second thickness smaller than the first thickness;
and
a wiring trace formed to extend on the first portion and the second portion of the insulating layer;
wherein
a boundary surface is formed between an upper surface of the first portion and an upper surface of the second portion, a boundary line between the upper surface of the first portion and the boundary surface extends in a first direction, and a lateral side of the wiring trace extends in a second direction that intersects with the first direction, and
the wiring trace is formed on an upper surface of the insulating layer such that the second direction forms an angle of not less than 60 degrees and not more than 90 degrees with the first direction.

4 more elements

A method for manufacturing a suspension board with circuits, comprising the steps of:

preparing a base material that has a laminated structure of a conductive support substrate and an insulating layer;
forming a first portion having a first thickness and a second portion having a second thickness smaller than the first thickness at the insulating layer by processing the insulating layer;
and
forming a wiring trace that extends on the first portion and the second portion of the insulating layer, wherein
a boundary surface is formed between an upper surface of the first portion and an upper surface of the second portion, and
the step of forming the wiring trace includes
forming the wiring trace on an upper surface of the insulating layer such that a boundary line between an upper surface of the first portion and the boundary surface extends in a first direction, a lateral side of the wiring trace extends in a second direction that intersects with the first direction, and the second direction forms an angle of not less than 60 degrees and not more than 90 degrees with the first direction.

4 more elements

Dependencies are inferred from the claim text.

Suspension board with circuits and method for manufacturing the same

Life of this patent

Suspension board with circuits and method for manufacturing the same

Life of this patent

Abstract

Claims10