Lithography system, method of clamping and wafer table
AssigneeMapper Lithography IP B.V.
InventorsGuido DE BOER, Michel Pieter DANSBERG, Pieter KRUIT
Life of this patent
Estimating the term…
Abstract
The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target (1) such as a wafer, said target being included in said system by means of a target table (2), clamping means being present for clamping said target on said table. Said clamping means comprises a layer or stationary liquid (3), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target (1) and target table (2), a pressure drop (PCap) arises.
Claims15
Method of exchanging a wafer (1) in a lithography apparatus, wherein said lithography apparatus has operating conditions at a vacuum, said method comprising:
- a step of placing said wafer (1) on a wafer table (8),
- a subsequent step (IT) of inserting said wafer table (8) and said wafer (1) in said lithography apparatus,
- a step (PW) of processing said wafer (1),
- a step (RT) of removing said wafer table (8) and said wafer (1) from the lithography apparatus,
- a step (DW) of detaching said wafer (1) from said wafer table (8), and
- a step of exchanging said wafer table (8) with another one for the purpose of exchanging the wafer (1) in said lithography apparatus, and
- a step of treating said wafer table (8) outside said lithography apparatus, in which treatment the temperature of said wafer table (8) is conditioned.
Dependencies are inferred from the claim text.